UV curing etching resist ink for acidic etching solution
(KSM-UV 201)
KSM-UV 201 is UV curing etching resist ink for acidic etching solution, which is used for making patterns on copper-clad laminates by means of acidic etching. The cured film can provide good adhesion, clear printing line, high resolution , resistance to the etching of acidic CuCl2/FeCl3 solution and fast removing coating.
Properties of Ink

Items	Technical features	Notes
Color	Blue
Fineness	≤8µm	0 ~25µm Fineness gauge
Viscosity (25?)	160±20dPa?s	VT-04F
Density (25?)	1.10 ~1.30 g/ml
Screen mesh	100 ~120T
Film thickness	10 ~12µm
Curing energy	1200 ~2000 mJ/cm2	The effective value through the polyester film
Pencil hardness	≥2H	Pencil hardness test
Adhesion	100/100	Laceration experiment
Etching resistance	FeCl3 or CuCl2 acidic solution	45±5?
Moving coating	3~5% NaOH solution ,20~40s	25~35?
Package	5.0 kg/bucket , 20 kg/box
Shelf time	6 months since the date of manufacture	Store below 25? in dark

Attention :
1. Mixing the ink fully before using.