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Наносится через трафарет с рисунком
Запекается при температуре 100°C в течение 1 часа.
Thermal curing solder mask (KSM-386 series)
KSM-386 series for two-component heat curing solder mask, with good printability, fast curing, curing after coating with excellent adhesion, heat resistance and chemical resistance.
Ink features:
Items Head | Special properties | Preparation Notes |
Yen color | Green color | |
Fine degree | ≤ 8 m | 0 ~ 25μm Fineness gauge |
The mixing ratio | Main agent / curing agent = 23/2 | Weight ratio |
After mixing viscosity (25° C) | 250 ± 50dPa · s | VT-04F |
Mixed density (25 ° C) | 1.20 ~1.40g/ Ml | |
Net Head | 36 ~ 51T | |
Film thickness | 18 ~ 22μm | Cured |
Curing conditions | 150 ° C, 30 to 60 minutes | Hot air circulation oven |
You can use the time after mixing | 24 hours | Less than25 ° CStore |
Pencil Hardness | ≥ 6H | Pencil Hardness Tester |
Adhesion | 100/100 | Experimental hundred cells |
Resistance soldering performance | 288 ?, 10s , 3 times No blistering off | IPC-SM-840D 3.7.3 |
Environmental standards | Comply with RoHS directive | SGS detection |
Package installed | Main agent:920gHardener80g | Customers can choose according to demand |
Main agent:4.6kgHardener0.4kg | ||
Storage period | After the production date 6 months | Less than25 ° CDark storage |